SYSTEM FOR HEAT TREATMENT OF SEMICONDUCTOR DEVICE

摘要

A heat treating system of the semiconductor device is provided, which can reduce the installation space of system by loading the furnace in two shifts. The loading unit(100) comprises the mobile substrate transfer board. The heat treatment unit(200) includes an upper furnace, a lower furnace, and a moving furnace. The substrate is received from the loading unit and is heat-treated in the upper furnace, the lower furnace, and the moving furnace. The upper furnace is positioned on the top of heat treatment frame. The lower furnace is positioned in the lower part of the upper furnace. The moving furnace is connected to the upper furnace or the lower furnace. The buffer elevator part(300) comprises the horizontal conveying plate and vertical conveying plate.