| 摘要 |
Disclosed is a method for forming the layout of a master-slice-type semiconductor integrated circuit having a bulk layer (BL) on which a plurality of bulk patterns to realize specific circuit functions are formed, and a plurality of wiring layers (PL2 to PL4) including variable wiring patterns of which wiring pattern is changeable by a user and fixed wiring layers (PL1, PL5 and PL6) of which wiring patterns are unchangeable by the user. A plurality of bulk patterns are previously fixed and placed on an entire chip surface where bulk patterns are capable of being formed in the bulk layer, and thereby, a semiconductor integrated circuit corresponding to a use purpose can be manufactured by only designing the wirings of the variable wiring layers and producing masks for forming the designed wirings in the wiring layers at the user side.
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