发明名称 CONDUCTIVE PATTERN AND METHOD OF FORMING THEREOF
摘要 <p>A conductive pattern and a method of forming the same are provided to improve an adhesive characteristic between a substrate and a pattern when a conductive pattern is formed by an inkjet process. A substrate is prepared. The first composition including adhesion improving agent and solvent is printed on the substrate to form the first pattern. The second composition including a conductive particle and solvent is printed on the first pattern to form the second pattern. The first pattern and the second pattern are plasticized.</p>
申请公布号 KR20090077705(A) 申请公布日期 2009.07.15
申请号 KR20090001498 申请日期 2009.01.08
申请人 LG CHEM. LTD. 发明人 PARK, JUNG HO;LEE, JONG TAIK
分类号 G02F1/1343 主分类号 G02F1/1343
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