发明名称 |
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING SAME, LEAD FRAME PACKAGE AND OPTICAL MODULE |
摘要 |
A printed wiring board (10) includes a plurality of conductor plates (10a) spaced apart from one another including at least one conductor plate that is used as a lead for electrical connection with an external circuit; an insulating layer (10b) formed on or astride the conductor plates or on and astride the conductor plates; and a plurality of wiring patterns (10d) formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns via a via-hole (11a), a method of manufacturing the printed wiring board, and a lead frame package and an optical module that use the printed wiring board. <IMAGE> |
申请公布号 |
EP1603158(A4) |
申请公布日期 |
2009.07.15 |
申请号 |
EP20040717227 |
申请日期 |
2004.03.04 |
申请人 |
FURUKAWA ELECTRIC CO., LTD. |
发明人 |
SHIRAI, TAKEHIRO;IWASE, MASAYUKI |
分类号 |
H01L23/50;G02B6/38;G02B6/42;H01L23/24;H01L23/498;H01R12/00;H05K1/05;H05K3/44 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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