发明名称 |
NON-THERMOFUSIBLE GRANULAR PHENOL RESIN, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR |
摘要 |
Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 µm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material. |
申请公布号 |
EP2078734(A1) |
申请公布日期 |
2009.07.15 |
申请号 |
EP20070829663 |
申请日期 |
2007.10.12 |
申请人 |
AIR WATER INC. |
发明人 |
YOSHINAGA, NAOTO;WAKAYAMA, YOSHIHARU;IBARAKI, SATOSHI;SHIMOMURA, JUN;MURAGE, YOSHIMI;SHIOMI, NIRO;KODANI, YOSHINOBU;IKEDA, TAKAOMI |
分类号 |
B01J20/20;B01J20/28;B01J20/30;C01B13/02;C01B21/04;C08G8/10;C08G59/62;C08J3/12;H01G11/24;H01G11/38;H01G11/42;H01M4/133;H01M4/587 |
主分类号 |
B01J20/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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