| 发明名称 |
Soldering of holes, method for coating and soldered rods |
| 摘要 |
<p>The wire or bar-shaped solder rod (22), comprises a stop-off (25), which is present at an end (28), moistens the rod and is made of ceramic or alloy. An independent claim is included for a method for joining a hole in a substrate with a solder using a soldering rod.</p> |
| 申请公布号 |
EP2078578(A1) |
申请公布日期 |
2009.07.15 |
| 申请号 |
EP20080000384 |
申请日期 |
2008.01.10 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
LADRU, FRANCIS-JURJEN, DR.;REICH, GERHARD |
| 分类号 |
B23K1/00;B23K35/02 |
主分类号 |
B23K1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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