发明名称 Charge modulation network for multiple power domains for silicon-on-insulator technology
摘要 An SOI integrated circuit includes ESD protection on an SOI chip. A first power domain and a second power domain are provided in the SOI chip. In one embodiment, a charge modulation network in the SOI chip between the first power domain and the second power domain mitigates accumulation of electrical charge in an electrically isolated region of the SOI chip. In another embodiment, an ESD protection device in the SOI chip electrically connects the first power domain and the second power domain via a low metal layer to provide a discharge path for accumulated charge.
申请公布号 US7560778(B2) 申请公布日期 2009.07.14
申请号 US20060519680 申请日期 2006.09.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CAIN DAVID A.;GAMBINO JEFFREY P.;ROHRER NORMAN J.;SELTZER DARYL M.;VOLDMAN STEVEN H.
分类号 H02H9/00 主分类号 H02H9/00
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