发明名称 |
Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof |
摘要 |
Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.
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申请公布号 |
US7559824(B2) |
申请公布日期 |
2009.07.14 |
申请号 |
US20060494613 |
申请日期 |
2006.07.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK MOO-YONG;KIM TAI-HYOUNG;KIM CHOON-GOANG;KIM DONG-IL |
分类号 |
B24B53/00;B24B53/017;B24B53/095;B24B53/12;H01L21/304 |
主分类号 |
B24B53/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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