SEMICONDUCTOR DEVICE FOR PREVENTION SHORT CIRCUIT BETWEEN ELECTRODE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

A semiconductor device for prevention a short circuit between an electrode and a semiconductor package using the same is provided to prevent a short circuit due to lump of conductive material by forming a plurality of protrusions on a space between the semiconductor devices. In a semiconductor device for prevention a short circuit between an electrode and a semiconductor package using the same, the semiconductor package comprises a first semiconductor device(100), a second semiconductor device(200), and an adhesive film(300). The first semiconductor device comprises a first electrode(110), and the second semiconductor device comprises a second electrode(210). The adhesive film is arranged between the first and the second semiconductor device and is connected with the first and the second electrode. The adhesive film is made of the adhesive resin mixture in which the conductive particle(350) is included.