发明名称 |
Semiconductor package and method of manufacturing the same |
摘要 |
A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.
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申请公布号 |
US7560805(B2) |
申请公布日期 |
2009.07.14 |
申请号 |
US20070812307 |
申请日期 |
2007.06.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO YOUNG-SANG;SHIN NA-RAE |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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