发明名称 |
LED package and backlight assembly for LCD comprising the same |
摘要 |
The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.
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申请公布号 |
US7560745(B2) |
申请公布日期 |
2009.07.14 |
申请号 |
US20070674493 |
申请日期 |
2007.02.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM HYUNG SUK;PARK YOUNG SAM;HAHM HUN JOO;PARK JUNG KYU;JEONG YOUNG JUNE |
分类号 |
G02F1/13357;F21V7/04;G02F1/1335;H01L25/075;H01L33/54;H01L33/56;H01L33/60 |
主分类号 |
G02F1/13357 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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