发明名称 Insulated gate transistor
摘要 A semiconductor device of the present invention is provided with a power device which has a semiconductor substrate having a first main surface and a second main surface that are opposed to each other and an insulating gate structure on the first main surface side, wherein a main current flows between the first main surface and the second main surface, that is to say, is provided with an insulating gate type MOS transistor structure wherein the thickness (t1) of the semiconductor substrate is no less than 50 mum and no greater than 250 mum and a low ON voltage and a high withstanding capacity against breakdown are implemented in the first main surface. Thereby, a low ON voltage, the maintaining of the withstanding capacity against breakdown and the reduction of a switching loss on the high voltage side can be implemented.
申请公布号 US7560771(B2) 申请公布日期 2009.07.14
申请号 US20040976931 申请日期 2004.11.01
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NAKAMURA KATSUMI;KUSUNOKI SHIGERU;NAKAMURA HIDEKI
分类号 H01L29/76;H01L21/331;H01L21/336;H01L29/06;H01L29/08;H01L29/40;H01L29/423;H01L29/45;H01L29/49;H01L29/739;H01L29/78 主分类号 H01L29/76
代理机构 代理人
主权项
地址