EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE

摘要

Disclosed is a epoxy resin molding material for sealing, which has excellent fluidability and solder-resistant reflow properties without being deteriorated in curability. Also disclosed is an electronic component device having an element sealed with the material. Specifically, the epoxy resin molding material comprises (A) an epoxy resin, (B) a curing agent, (C) a curing-accelerating agent, (D) an inorganic filler and (E) alkoxysilane polymer, wherein the alkoxysilane polymer (E) is produced by polymerizing an alkoxysilyl group moiety in a specific alkoxysilane compound.