发明名称 EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE AND WAFER LOADING/UNLOADING METHOD USED THE SAME
摘要 A semiconductor manufacturing facility and wafer loading/unloading method are provided, which can increase the productivity by loading a plurality of wafers on a boat to the maximum. The reaction tube is formed in order to have the bell. The plate(130) is formed in order to seal the lower part of the reaction tube hermetically. The reacting gas providing unit supplies the reaction gas into the reaction tube. The reaction gas discharge unit discharges the reaction gas supplied to the reaction tube. The first boat(140) supports the bottom of a plurality of wafers on the plate. The second boat(150) is formed in order to support the top of a plurality of wafers.
申请公布号 KR20090076451(A) 申请公布日期 2009.07.13
申请号 KR20080002411 申请日期 2008.01.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JUN SIG;KIM, JUNG HYEON;SHIN, JIN HO;IVANOV GENNADY
分类号 H01L21/68;H01L21/67 主分类号 H01L21/68
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