| 摘要 |
An apparatus for fabricating semiconductor device is provided, which prevents the fault of adsorption to the wafer by forming the magnetic field and centrifugal force. The robot arm(12) fixes the wafer(10). In the bass(14), wafer is chemically reacted with the process solution. The first metal electrode(16a) is inserted into the robot arm. The second metal electrode(16b) is inserted into the bass. Voltage is applied to the first metal electrode and the second metal electrode. The first metal electrode is formed outside the robot arm in the round vertical line shape.
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