| 摘要 |
<p>A device for extracting and separating a metal and PVC of a waste ink die semiconductor is provided to prevent environmental contamination of soil and atmosphere due to disposal of a conventional waste ink die semiconductor. A device for extracting and separating a metal and PVC of a waste ink die semiconductor includes a motor(1), a rotating net(6) rotated by vibration of torque with the motor, and a drum(3) covered with the rotating net. An outer side of the drum is formed with an insulating layer(4). A heating layer(35) in which a heating coil(5) is formed is installed at the inside the insulating layer. A heating layer protective plate(99) is formed on an inner side of the heating layer.</p> |
