METHOD OF FORMING SOLDER BUMP AND APPARATUS OF FILLING MELTED SOLDER USED BY PERFORMING THE METHOD

摘要

A solder bump production method and a molten solder filling apparatus which is used to the same are provided, which improve the whole processing efficiency by reducing the process time. A plurality of penetration holes are formed in the template(100). The template having a plurality of holes(110) is dipped in the molten solder(310). The molten solder is filled into the penetration hole of the template. The template in which the molten solder is filled is adjacent to the conductive pad of the electronic component. The molten solder is transplanted on the conductive pad of the electronic component. The electronic component is heated up and the molten solder transplanted in the conductive pad is transformed into the solder bump.