| 摘要 |
A microphone package, a lead frame, a mold substrate, and a mounting structure thereof are provided to prevent a sound leakage by integrating a distal surface of a cylindrical protrusion with a stage. A housing has a hollow cavity and a sound hole. A microphone chip(5) is arranged inside the housing to detect the change of the pressure applied through the sound hole. The housing includes a mold substrate(3) and a cover. The microphone chip is mounted on a surface of the mold substrate. The cover is coupled with the mold substrate to form the hollow cavity for receiving the microphone chip. The mold substrate includes a stage(11), a plurality of lead terminals(13), and a resin mold(15). The microphone chip is mounted on the stage. The plurality of lead terminals are electrically connected to the microphone chip. The mold resin electrically insulates a plurality of lead terminals from the stage. |
