| 摘要 |
An apparatus for testing a semiconductor device package and a multi-level pusher used the same are provided to increase and maximize product yield by applying a multi-level pusher having different thickness to the electric property of a semiconductor package. A test board(50) electrically tests a semiconductor package chip, and the test board and the semiconductor package(52) are electrically contacted with the socket(60). The circumference of socket is defined by a hole of the tray, and an insert block(70) is inserted into the hole of the tray and fixes the semiconductor package. The pusher is controlled by a multi-level and pushes an upper part of the semiconductor package by a certain pressure.
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