| 摘要 |
A solid-state imaging device is provided with a multilayer wiring board (2) having an opening section (21); a spacer (3), which is covered with a conductive film (32) and is fixed to the multilayer wiring board (2) in a status where the conductive film (32) is brought into surface contact with a reference potential electrode exposed in the opening section (21) of the multilayer wiring board (2); a solid-state imaging element (4), which is fixed to the spacer (3) by being brought into surface contact with the conductive film (32) of the spacer (3) and is arranged in the opening section (21); and an optical element (5), which is fixed at a position facing the solid-state imaging element (4) through the spacer (3) and transmits light into the opening section. |
