| 摘要 |
A template for forming solder bumps and a method of manufacturing the same are provided to make a cavity as a domed shape in etching process by making the speed of etching of a mold film formed on the substrate increase in depth direction. A mold film is formed on the substrate(100) and a plurality of hemi-spherical cavities(108) for solder bumps are formed on the surface of the substrate. The mold layer has the etch rate that is increased to the longitudinal direction facing substrate from the surface area. The mold layer comprises a first impurity and a second impurity, and the concentration ratio between the second impurity and the first impurity are changed to the longitudinal direction. The mold layer is formed on the substrate, and a plurality of cavities for etching the surface area of the mold layer and forming solder bumps is formed.
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