METHOD OF FORMING SOLDER BUMP

摘要

A solder bump production method for reducing the process time is provided, which enables substitution of forming the solder ball. A plurality of holes(130) are formed in the template(100). A part of the molten solder injected in holes is projected by increasing or reducing the size of the holes formed in template. The template is positioned in order to be adjacent to the electronic component in which a plurality of conductive pads are formed in the upper side. The conductive pad of the electronic component and the molten solder(410) protruded to the outside of holes are welded and the molten solder injected in holes is delivered to the conductive pad. The template is cooled and the size of holes is increased.