| 摘要 |
A template for the solder bumper formation and a solder bumper formation method are provided, which transplant the solder ball to the bumper pad of substrate easily. A template for the solder bumper(135) formation comprises the first plate and the second plate. The first plate has a plurality of penetrated openings. The second plate forms a plurality of penetrated openings into the cavity by coming into contact with the first plate. A plurality of penetrated openings are formed in the first plate. The opening of the template(110) is charged with the solder paste. The solder paste is heated up. The solder paste is formed into the solder ball. The solder ball is transplanted in the bumper pad(145) of the substrate.
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