LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR ELEMENT WITH ADHESIVE LAYER, SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

This invention provides a liquid resin composition for use in bonding of a semiconductor element onto a support. The tackiness of the liquid resin composition at 25°C upon heat treatment at 120°C for 10 min is not more than 0.05 N, and the tackiness of the liquid resin composition at 80°C is not less than 1 N. There is also provided a semiconductor wafer with an adhesive layer formed from the liquid resin composition. The present invention further provides a method for manufacturing a semiconductor element, comprising a coating step of coating an adhesive, formed of a liquid resin composition comprising a heat curable resin and a solvent,on one side of the wafer, a volatilization step of volatilizing the solvent while substantially maintaining the molecular weight of the liquid resin composition to form an adhesive layer, an applying step of applying a dicing sheet onto one side of the wafer, and a cutting step of cutting the wafer into pieces.