| 摘要 |
A substrate for BGA package and a method for manufacturing the same are provided, which can decrease the process and inferiority rate of package. The voland(208) is arranged in one side of the insulating layer(202). The solder resist(206) is applied on one side of the insulating layer in order to expose the voland. The coating film(210) is applied on the solder resist and voland. The solder ball is adhered on the voland in which the coating film is applied. The coating film is made of the polyethylene or the epoxy material containing one particle among nickel, aluminum, silver, iron, copper, and gold particle. |
