| 摘要 |
A silicon wafer detachment device and a detachment process using the same are provided, which can prevent the scratch from being generated in the wafer back side. The silicon wafer detachment device comprises the sliding plate(110). After the silicon wafer adhered to the ceramic plate(10) is attached and detached, the sliding plate is slid and is moved. The center of the sliding plate is open in the traveling direction of the silicon wafer. In order not to disturb the sliding of wafer, the sliding plate is installed at the location lower than the upper side of the ceramic plate. The roller(114) is installed at the opened part of the sliding plate and supports wafer. In order to support the slid wafer, the stair jaw(116) corresponds to the curvature of wafer.
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