| 摘要 |
A semiconductor package and a method of manufacturing the same are provided, which can improve the reliability of the semiconductor package by forming the semiconductor package in which the reinforcing material is adhered. The substrate(100) comprises a plurality of connection pads in the upper side. The semiconductor chip(110) is adhered on the substrate in order to be electrically connected to the substrate. The reinforcing material(130) is adhered to the upper side edge part of the substrate. The molding unit(140) is formed on the upper side of the substrate including the reinforcing material in order to surround the semiconductor chip. The reinforcing material is adhered to the outer side of the connection pad. The reinforcing material consists of the adhesive formed into the adhesion solution of the liquid type and the adhesive tape of the film type.
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