| 摘要 |
A wafer map production method and an apparatus thereof are provided, which can rapidly form the map configuration about wafer. The memory unit(102) stores the die size set up information. The controller(100) sets up the reference line and die heat about the wafer camera information. The controller detects the first valid die toward the edge of the first direction about the die heat around the reference line. The controller detects the valid die around the reference line in the first valid die from the symmetrical domain. The various kinds of commands or the information is input from a user and the user interface(104) provides it to the controller.
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