Package optical chip with conductive pillars

摘要

A package structure and a fabricating method thereof are provided. The package structure includes a soft board and an optical chip. The soft board has a surface with a bump disposed thereon. The optical chip includes a main body and a conductive pillar. The main body has an active surface and a non-active surface opposite to the active surface. The active surface has a sensing area and a contact pad electrically connected with each other. The non-active surface is attached to the surface. The conductive pillar is disposed inside the main body, and penetrates the active surface and the non-active surface. The conductive pillar has a first end electrically connected to the contact pad and a second end electrically connected to the bump.