发明名称 |
HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS |
摘要 |
A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate.
|
申请公布号 |
US2009176120(A1) |
申请公布日期 |
2009.07.09 |
申请号 |
US20090350896 |
申请日期 |
2009.01.08 |
申请人 |
TREADSTONE TECHNOLOGIES, INC. |
发明人 |
WANG CONGHUA |
分类号 |
B32B3/00;B05D1/04;B32B15/00;B44C1/22;C23C14/34;C23C16/26 |
主分类号 |
B32B3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|