| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board which is useful to mount a compact and thin semiconductor device and the semiconductor device which is compact and thin and can be mounted, and to provide manufacturing methods thereof. <P>SOLUTION: On an upper surface of a support, a first conductive layer 3 is formed across a first adhesive layer 2 predisposed to decrease in adhesive strength under a temperature condition at predetermined reference temperature or more, a second conductive layer 4 is deposited covering at least a bottom surface and an inner wall of a recess, and the first conductive layer 3 and the second conductive layer 4 are subjected to etching to form a printed circuit board 16. The entire surface of the printed circuit board is covered with resist 5, a semiconductor chip 7 is mounted on an upper surface of the resist 5 across a second adhesive layer 6 having higher adhesive strength than the first adhesive layer 2 under a temperature condition at the reference temperature or more, and a bonding wire 8 is formed connecting the chip 7 and a lead terminal 11 to each other; and the chip 7 and bonding wire 8 are sealed with a resin sealing layer 12 from above, cutting into predetermined units is carried out, and the adhesive strength between a semiconductor device and a support is decreased by heating to separate the semiconductor device from the support. <P>COPYRIGHT: (C)2009,JPO&INPIT |
