发明名称 METHOD OF MANUFACTURING WIRING CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board in which it is hard to cause a short circuit between mutually adjacent first terminals in a process of electrically connecting a first wiring circuit board and a second wiring circuit board to each other. <P>SOLUTION: In the method of manufacturing the wiring circuit board, a flexible wiring circuit board 1 having solder bumps 18 formed on a first cover insulating layer 6 in contact with first terminal portions 5, and a suspension substrate 9 with a circuit which has second terminal portions 15 area disposed in a state wherein the solder bumps 18 and second terminal portions 15 are opposed to each other along the length, and then the solder bumps 18 are fused to electrically connect the first terminal portions 5 to the second terminal portions 15 through the solder bumps 18. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009152238(A) 申请公布日期 2009.07.09
申请号 JP20070326307 申请日期 2007.12.18
申请人 NITTO DENKO CORP 发明人 MOTOGAMI MITSURU
分类号 H05K1/14;H05K1/05;H05K1/11 主分类号 H05K1/14
代理机构 代理人
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