发明名称 SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate temperature adjusting-fixing device comprising an electrostatic chuck having a base body and a resistance heater embedded in the base body to heat a substrate, the substrate temperature adjusting-fixing device being capable of raising the temperature of the whole substrate up to prescribed temperature through short-time heating. SOLUTION: The substrate temperature adjusting-fixing device 10 includes: the electrostatic chuck 11 which is provided with the base body 21 having a substrate placement surface 21A for placing a substrate 20 thereon, an electrostatic electrode 22 embedded in the base body 21, and the resistance heater 23 embedded in the base body 21 to heat the substrate 20; and a base plate 12 which is internally provided with a cooling mechanism 46 for cooling the electrostatic chuck 11 and supports the electrostatic chuck 11, wherein a heat insulation portion 47 is provided in a base plate body 45 at a portion located between the cooling mechanism 46 and the electrostatic chuck 11. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152475(A) 申请公布日期 2009.07.09
申请号 JP20070330600 申请日期 2007.12.21
申请人 SHINKO ELECTRIC IND CO LTD 发明人 YONEKURA HIROSHI;KOYAMA TOMOAKI;TAMAGAWA TERUKI
分类号 H01L21/683;H05B3/74 主分类号 H01L21/683
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