摘要 |
PROBLEM TO BE SOLVED: To provide a substrate temperature adjusting-fixing device comprising an electrostatic chuck having a base body and a resistance heater embedded in the base body to heat a substrate, the substrate temperature adjusting-fixing device being capable of raising the temperature of the whole substrate up to prescribed temperature through short-time heating. SOLUTION: The substrate temperature adjusting-fixing device 10 includes: the electrostatic chuck 11 which is provided with the base body 21 having a substrate placement surface 21A for placing a substrate 20 thereon, an electrostatic electrode 22 embedded in the base body 21, and the resistance heater 23 embedded in the base body 21 to heat the substrate 20; and a base plate 12 which is internally provided with a cooling mechanism 46 for cooling the electrostatic chuck 11 and supports the electrostatic chuck 11, wherein a heat insulation portion 47 is provided in a base plate body 45 at a portion located between the cooling mechanism 46 and the electrostatic chuck 11. COPYRIGHT: (C)2009,JPO&INPIT |