发明名称 HEAT-TREATING JIG FOR CHIP-LIKE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a light-weight heat-treating jig easily releasing gases and assuring enough mechanical strength. SOLUTION: A receiving member 2 to load chip-like electronic components has a loading surface 20 having a lot of through-holes. The loading surface 20 has an irregular shape formed with repeated mountain folds P and valley folds V. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152476(A) 申请公布日期 2009.07.09
申请号 JP20070330601 申请日期 2007.12.21
申请人 TDK CORP 发明人 ITO YASUYA
分类号 H01G13/00;H01G4/12;H01G4/30 主分类号 H01G13/00
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