| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an assembly structure of a semiconductor device that can facilitate assembly of the semiconductor device and suppress the manufacturing cost by solving the problem that bonding wires connecting a semiconductor element and a substrate etc., to each other short-circuits owing to a wire flow etc., during resin molding. <P>SOLUTION: Disclosed is the assembly structure of the semiconductor device which is assembled by connecting the semiconductor element 10 and substrate 22 to each other by the bonding wires 24, the semiconductor device being assembled by performing wire bonding wherein the bonding wire 24 is passed between adjacent shield projections among shield projections 32 with electric insulating properties using a relay substrate 30 having the plurality of shield projections 32 formed on a resin substrate 34 at a spacing large enough to pass the bonding wire 24 along positions that the bonding wire 24 passes to a height for restricting sideward displacement of the bonding wire to avoid interference with an adjacent bonding wire 24. <P>COPYRIGHT: (C)2009,JPO&INPIT |
