发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ELECTRIC EQUIPMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having a circuit capable of high speed operation at reduced manufacturing cost, the semiconductor device, and electronic equipment. <P>SOLUTION: A non-single-crystal semiconductor layer is formed over a substrate, and then a single crystal semiconductor layer is formed over part of the non-single-crystal semiconductor layer. Thus, a semiconductor element of a region which requires a large area (e.g. a pixel region in a display device) can be formed using the non-single-crystal semiconductor layer, and a semiconductor element of a region which requires high speed operation (e.g. a driver circuit region in a display device) can be formed using the single crystal semiconductor layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009152565(A) |
申请公布日期 |
2009.07.09 |
申请号 |
JP20080293169 |
申请日期 |
2008.11.17 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YOKOI TOMOKAZU;SAKURADA YUJIRO |
分类号 |
H01L21/02;G02F1/1345;G02F1/1368;H01L21/20;H01L21/265;H01L21/336;H01L21/8234;H01L27/08;H01L27/088;H01L27/12;H01L29/786 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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