发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ELECTRIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having a circuit capable of high speed operation at reduced manufacturing cost, the semiconductor device, and electronic equipment. <P>SOLUTION: A non-single-crystal semiconductor layer is formed over a substrate, and then a single crystal semiconductor layer is formed over part of the non-single-crystal semiconductor layer. Thus, a semiconductor element of a region which requires a large area (e.g. a pixel region in a display device) can be formed using the non-single-crystal semiconductor layer, and a semiconductor element of a region which requires high speed operation (e.g. a driver circuit region in a display device) can be formed using the single crystal semiconductor layer. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152565(A) 申请公布日期 2009.07.09
申请号 JP20080293169 申请日期 2008.11.17
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YOKOI TOMOKAZU;SAKURADA YUJIRO
分类号 H01L21/02;G02F1/1345;G02F1/1368;H01L21/20;H01L21/265;H01L21/336;H01L21/8234;H01L27/08;H01L27/088;H01L27/12;H01L29/786 主分类号 H01L21/02
代理机构 代理人
主权项
地址