| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is compact and is easily mounted. SOLUTION: The semiconductor device includes: a semiconductor element 13 which has a first electrode 11 formed on a first surface and a second electrode 12 formed on a second surface opposite from the first surface: an insulating resin 14 which covers a periphery of the semiconductor element 13 including outer peripheral parts of the first and second electrodes 11 and 12; a first connection conductor 16 formed on a first surface of the insulating resin 14 by burying a first through-hole 15 extending from the first surface of the insulating resin 14 opposite from the first electrode 11 to the first electrode 11; and a second connection conductor 18 formed on a second surface of the insulating resin 14 by burying a second through-hole 17 extending from the second surface of the insulating resin 14 opposite from the second electrode 12 to the second electrode 12. COPYRIGHT: (C)2009,JPO&INPIT |
