发明名称 STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure which can easily dismount a mounted electronic component without a substantial cost increase. SOLUTION: In the mounting structure having the electronic component 1 on a substrate 2 provided with a bus bar 6 so that a lead terminal 3 of the electronic component 1 is electrically connected to the bus bar, a connection hole 8 is provided in the bus bar so that the lead terminal is inserted into the hole or extracted therefrom and the lead terminal is electrically connected to the bus bar while the lead terminal is inserted in the hole, and the electronic component is mounted when the lead terminal is inserted in the hole. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152495(A) 申请公布日期 2009.07.09
申请号 JP20070330990 申请日期 2007.12.21
申请人 YAZAKI CORP 发明人 TAKAHASHI TAKAKAZU;AONO KOICHI
分类号 H05K1/18;H05K1/02 主分类号 H05K1/18
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