发明名称 |
HIGH-FREQUENCY TRANSMISSION LINE CONNECTION STRUCTURE, WIRING SUBSTRATE, HIGH-FREQUENCY MODULE, AND RADAR DEVICE |
摘要 |
<p>It is possible to provide a high-frequency transmission line connection structure, a wiring substrate having the connection structure, a high-frequency module having the wiring substrate, and a radar device. A first layered type waveguide sub-line unit (21) includes a pair of main conductor layers opposing to each other in the thickness direction so as to sandwich a dielectric layer (31) having the same thickness as the dielectric layer (31) of a micro strip line (1). A second layered type waveguide sub-line unit (22) includes dielectric layers (31, 32) having a thickness greater than the dielectric layer of the first layered type waveguide sub-line unit (21). A layered type waveguide main line unit (23) includes dielectric layers (31, 32, 33) having a thickness greater than the dielectric layer of the second layered type waveguide sub-line unit (22). The micro strip line (1) is connected to a conversion unit (10) having an upper main conductive layer constituting the respective line units which are formed as a unitary block.</p> |
申请公布号 |
WO2009084697(A1) |
申请公布日期 |
2009.07.09 |
申请号 |
WO2008JP73872 |
申请日期 |
2008.12.27 |
申请人 |
KYOCERA CORPORATION;MIYAZATO, KENTARO;HAYATA, KAZUKI;KISHIDA, YUJI |
发明人 |
MIYAZATO, KENTARO;HAYATA, KAZUKI;KISHIDA, YUJI |
分类号 |
H01P1/04;G01S7/03;G01S13/02;H01P3/12;H01P5/02;H01P5/107;H04B1/38 |
主分类号 |
H01P1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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