发明名称 GRINDING PAD, ITS MANUFACTURING METHOD, GRINDING DEVICE, AND GRINDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a grinding pad which can eliminate problems such as scratching during a grinding process, and at the same time can extend the replacing cycle thereof, and to provide a grinding pad manufacturing method, a grinding device, and a grinding method. <P>SOLUTION: The grinding pad 110a has a base layer 111, and a grinding layer 112 which is arranged on the base layer 111 and to which a grinding liquid is fed. The grinding layer 112 has first grooves 112a formed in a first surface (upper surface) opposite to the base layer 111 and second grooves 112b formed in a second surface (lower surface) of the base layer 111 side and appearing when the first layer is worn by a predetermined quantity. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009148867(A) 申请公布日期 2009.07.09
申请号 JP20070330776 申请日期 2007.12.21
申请人 FUJITSU MICROELECTRONICS LTD 发明人 ISHIKAWA KAZUHIRO
分类号 B24B37/26;H01L21/304 主分类号 B24B37/26
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