METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING INTERIM PRODUCT OF SEMICONDUCTOR DEVICE, INTERIM PRODUCT OF SEMICONDUCTOR DEVICE, AND LEAD FRAME

摘要

A semiconductor element (11), a columnar terminal (14) which is arranged around the semiconductor element (11) in an area array form, and a bonding wire (16) which electrically connects an electrode pad (15) of the semiconductor element (11) and a wire bonding portion (12) of the columnar terminal (14) are included. The semiconductor element (11), the bonding wire (16), and an upper half exposed portion of the columnar terminal (14) are sealed with a resin. A part of the each columnar terminal (14) is projected from a lower end of a sealing resin (17). The columnar terminal (14) is formed with a half etching from a front side and a back side. Gold plating, tin plating, tin alloy plating, or nickel plating (23) is applied to the upper surface of the each columnar terminal (14). Tin plating, tin alloy plating, or nickel plating (25) is applied to the lower surface of the each columnar terminal (14) projected from the sealing resin (17).