发明名称 TESTING METHOD PRIOR TO PLATING AND INSTRUMENT FOR TEST PRIOR TO PLATING
摘要 PROBLEM TO BE SOLVED: To provide a testing method prior to plating, which can previously check a part that will not be plated in an alignment plating process and thereby can previously prevent the not-plated part from being formed, and to provide an instrument for the test prior to plating. SOLUTION: The testing method prior to plating is a method of detecting the presence or absence of a plating failure on an object to be plated which is an electronic component having a base and a lead that projects from the base, before practically plating the object, and includes the steps of; fixing a plurality of objects to be plated to an electroconductive plate 30 having a fixing part for fixing the lead of the object to be plated formed thereon; and measuring electrical conduction between the electroconductive plate 30 and the lead of the object to be plated which has been fixed to the electroconductive plate. The testing instrument 40 is used for the test. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009149934(A) 申请公布日期 2009.07.09
申请号 JP20070328024 申请日期 2007.12.19
申请人 SHINKO ELECTRIC IND CO LTD 发明人 TOSAWA YOSHIMASA;TANAKA HIROSHI
分类号 C25D21/12;C25D7/00;C25D17/08 主分类号 C25D21/12
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