| 摘要 |
PROBLEM TO BE SOLVED: To provide a light receiving module with excellent productivity without requiring transfer mold, by suppressing adverse affect on a high frequency signal and high speed response due to parasitic impedance. SOLUTION: The light receiving module includes: a pre-amplifier circuit chip 3 in which a light receiving element 2 is mounted in a flip chip form; accommodation sections 8a and 8b for accommodating the light receiving element 2 and the pre-amplifier circuit chip 3; a package 4 including a transmission aperture 7 of signal light which the light receiving element 2 receives, wiring conductors and electrodes; and a sleeve 9 for connecting and holding an optical fiber. The pre-amplifier circuit chip 3 is mounted in the flip chip form on the electrodes of the package 4, and the sleeve 9 is adjusted so that the signal light from the optical fiber may be received by the light receiving element 2 and is fixed to the package 4. The package 4 is formed by stacking a plurality of ceramic substrates, and the transmission aperture 7 of the signal light is sealed by a sealing plate 5 which has translucency for a predetermined light wavelength. COPYRIGHT: (C)2009,JPO&INPIT |
