发明名称 |
Semiconductor device and method of forming the same |
摘要 |
A semiconductor device and a method of forming the same are provided. A semiconductor device may comprise a semiconductor substrate including a main surface configured to define a groove, a trench, and a cavity sequentially disposed downward from a given region of the main surface and open toward the main surface.
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申请公布号 |
US2009174039(A1) |
申请公布日期 |
2009.07.09 |
申请号 |
US20090318774 |
申请日期 |
2009.01.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE CHAN-MI;PARK JONG-CHUL |
分类号 |
H01L27/00 |
主分类号 |
H01L27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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