发明名称 Semiconductor device and method of forming the same
摘要 A semiconductor device and a method of forming the same are provided. A semiconductor device may comprise a semiconductor substrate including a main surface configured to define a groove, a trench, and a cavity sequentially disposed downward from a given region of the main surface and open toward the main surface.
申请公布号 US2009174039(A1) 申请公布日期 2009.07.09
申请号 US20090318774 申请日期 2009.01.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE CHAN-MI;PARK JONG-CHUL
分类号 H01L27/00 主分类号 H01L27/00
代理机构 代理人
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