APPLICATION OF A PROCESSING PIN TO A GEMSTONE WHICH IS TO BE CUT OR POLISHED

摘要

Application of a next processing pin (20,30), as a follow-on pin, to a stone, wherein the latter is retained by a preceding pin (10) which is fixed on the stone via a first adhesive-bonding location (11, 11a). The preceding pin (10) is separated off from the stone. The follow-on pin is fixed on the stone via a second adhesive-bonding location (21, 31) - which is spaced apart from the first adhesive-bonding location. The stone is retained on the preceding pin (10) as the follow-on pin (20, 30) is being applied. The follow-on pin frontally absorbs a fluid adhesive at a distance from the stone, and the distance between the adhesive-coated front end and stone (3) is reduced until the adhesive-coated front end comes into contact with the stone. At the contact location, as second adhesive-bonding location (21, 31), the adhesive is cured and heat is transmitted to the first adhesive-bonding location via the preceding pin, the heat being introduced into the preceding pin at a distance (a) from the first adhesive-bonding location. The adhesive-bonding location (11) softens. The preceding pin is subjected to a force component (Fq) in order for the pin to be released from the stone and for the stone to be retained by the next pin.