发明名称 MULTI-BAND, MULTI-DROP CHIP TO CHIP SIGNALING
摘要 A multi-band, multi-drop signaling system. First, second and third integrated circuit devices are coupled to one another via a common signaling link. The first integrated circuit device includes a first transmitter to transmit a baseband signal via the signaling link and a second transmitter to transmit a signal centered around a non-zero frequency via the signaling link.
申请公布号 WO2009085417(A2) 申请公布日期 2009.07.09
申请号 WO2008US83231 申请日期 2008.11.12
申请人 RAMBUS INC.;ZERBE, JARED, L.;STOJANOVIC, VLADIMIR, M.;KOLLIPARA, RAVINDRANATH;BEYENE, WENDEMAGEGNEHU;AMIRKHANY, AMIR;GARLEPP, BRUNO 发明人 ZERBE, JARED, L.;STOJANOVIC, VLADIMIR, M.;KOLLIPARA, RAVINDRANATH;BEYENE, WENDEMAGEGNEHU;AMIRKHANY, AMIR;GARLEPP, BRUNO
分类号 H04L25/08;G06F13/40;H04L5/06 主分类号 H04L25/08
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