发明名称 |
PATTERNING A THICK FILM PASTE IN SURFACE FEATURES |
摘要 |
<p>This invention relates to a method for the fabrication of electrical and electronic devices using a photoresist deposited in pre-existing through holes in a device structure and a thick film paste, and to the devices made by such method. The method allows thick film paste deposits in the corners of the holes. This invention also relates to devices made with thick film pastes that are patterned using a diffusion layer made from residual photoresist deposits in a hole.</p> |
申请公布号 |
WO2009086100(A1) |
申请公布日期 |
2009.07.09 |
申请号 |
WO2008US87673 |
申请日期 |
2008.12.19 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY;CHENG, LAP-TAK, ANDREW |
发明人 |
CHENG, LAP-TAK, ANDREW |
分类号 |
H01J1/304;H01J9/02;H05K3/40 |
主分类号 |
H01J1/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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