| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate in which a corrosion caused by the oxidation of a base plating layer interposed between a wiring layer and a gold-plate layer is effectively restrained and which has excellent reliability such as connection reliability and so on of electric parts. SOLUTION: The wiring substrate 9 has a wiring layer 2 on the surface of an insulation substrate 1, the wiring layer 2 being covered by the base plating layer 3 and the gold-plate layer 4 sequentially. A base metal 5 whose standard electrode potential is lower than that of a metal forming the base plating layer 3 is positioned so as to contact the gold-plate layer 4 on the surface of the insulation substrate 1. The corrosion caused by the oxidation of the base plating layer 3 can be effectively restrained because the base metal 5 whose standard electrode potential is lower than that of the metal forming the base plating layer 3 is oxidized preferentially and the oxidation of metals forming the base plating layer 3 is restrained. COPYRIGHT: (C)2009,JPO&INPIT
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