| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a coil forming method capable of suppressing reduction in the film thickness accompanying bending work, and suppressing lowering in lamination factor due to deformation of the shape, and a coil forming die. <P>SOLUTION: The coil forming method comprises conducting predetermined preliminary forming work on a coil 1 before conducting bending work on the coil. The preliminary forming work is compression work on the coil 1 under the linear state to compress the coil in a region covering a rounded corner portion formed when bending work is conducted to decrease a dimension of the coil in a widthwise direction. The dimension of the coil is decreased in the widthwise direction by the nearly same dimension as that of the coil bulged in the widthwise direction when bending work is conducted in the absence of the preliminary forming work. This prevents the occurrence of bulging of a conductive material 1a during bending work, thereby preventing the shape of the conductive material 1a from being largely varied to suppress the lowering in lamination factor. Further, since requiring no compression of bulging generated in the inner root part of the round corner portion after conducting the bending work, the film 1b is prevented from being thinning by crushing the film 1b by compression, thereby ensuring the electrical insulation with the adjacent coil 1. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
