| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating sheet having excellent handling property in an uncured state and giving a cured product excellent in dielectric breakdown characteristics, thermal conductivity and adhesiveness. SOLUTION: The insulating sheet 3 is used for bonding a heat conductor 4 having a thermal conductivity of not less than 10 W/m×K to an electrically conductive layer 2, wherein the sheet 3 includes a polymer (A) having aromatic skeletons by 30 to 80 wt.% in 100 wt.% of whole skeletons and having a weight average molecular weight of not less than 10,000, an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of not more than 600 and/or an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of not more than 600, a curing agent (C) and a filler (D). COPYRIGHT: (C)2009,JPO&INPIT |
